The AI Stack
Sign in

JetCool

JetCool develops direct-to-chip liquid cooling for AI data centers using microconvective jet technology.

Updated April 2026

Overview

Segment
Cooling & Thermal Management

Product overview

JetCool provides single-phase direct-to-chip liquid cooling modules, cold plates, and CDUs that handle over 2,000W per chip, eliminating thermal pastes and enabling warm coolant over 60°C for heat recovery. Trusted by chipmakers like Intel, NVIDIA, AMD, Broadcom, OEMs such as Dell, hyperscalers, and colocation providers like Start Campus., . Its patented microconvective technology uses fluid jets to target hotspots precisely, outperforming air cooling by >80% and saving 18% power without water use. Acquired by Flex in 2024, it offers end-to-end solutions from chip to rack for scalable AI deployments.

Revenue model

Sells hardware products (cold plates, SmartPlate systems, CDUs) directly and through OEM/channel partners like Dell (~10% server upgrade cost); partnerships for colocation integration (e.g., Start Campus); no public $/kW or contract specifics.

Moat

  • Patents/IP
  • Proprietary Technology

JetCool's key competitive moat is its patented microconvective cooling® technology, which delivers superior thermal performance, 25% better efficiency than conventional cold plates, reduced energy and water usage, and enables higher compute density for AI and high-power data centers.