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Avicena

Avicena develops microLED-based ultra-low power optical interconnects for AI data centers and HPC.

Updated April 2026

Overview

Founded
2019
Headquarters
Sunnyvale, CA, USA
Segment
Optical Interconnect & Photonics

Product overview

Avicena produces LightBundle chiplet transceivers and evaluation kits using microLED arrays for high-density, low-latency chip-to-chip and rack-scale optical links. Hyperscalers, AI accelerator makers, memory vendors, and semiconductor firms like SK Hynix and Lam Research integrate them into AI clusters and memory disaggregation systems. Distinct from laser-based or copper solutions, microLEDs enable sub-100fJ/bit efficiency without temperature control, scaling to thousands of GPUs across racks.

Revenue model

Sales of microLED interconnect chiplets, transceivers, and evaluation kits to AI infrastructure partners.

Moat

Avicena's competitive moat is its first-mover advantage in microLED-based optical interconnects combined with proprietary integration of mature, high-volume GaN microLED display technology into chip-scale communications, enabling sub-pJ/bit energy efficiency that competitors using laser-based or silicon photonics solutions cannot match. This is reinforced by strategic partnerships with TSMC and ams OSRAM, 47 filed patents focused on optical devices and photonics, and the high switching costs for hyperscalers once LightBundle is integrated into their AI infrastructure.

Headwinds

MicroLED optical technology faces manufacturing challenges and market acceptance against established electrical interconnects.